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filingDate 2016-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82edb83902b16c763616d0fc54c15a3d
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publicationDate 2020-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I703199-B
titleOfInvention Conductive adhesive layer, conductive adhesive sheet, printed circuit board and electric device
abstract The present invention provides a conductive adhesive layer that has good temporary adhesion, is difficult to produce adhesion and surface-to-surface adhesion, has good adhesion strength with metal reinforcement plates, and has good connection reliability after reflow, and has Its conductive adhesive sheet, printed wiring board and electronic equipment. The conductive adhesive layer (2) of the present invention is a conductive adhesive layer (2) formed on the peelable film (1) and used, and the surface roughness Ra of the surface B on the peelable film (1) side is 3 μm ~6 μm, and the surface roughness Ra of the surface A on the other side is 0.2 μm to 1.1 μm.
priorityDate 2015-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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