| abstract |
The present application relates to an adhesive composition and an organic electronic device including the same, and capable of forming an encapsulation structure that can effectively block moisture or oxygen introduced into the organic electronic device from the outside, thereby securing the life of the organic electronic device. The present invention provides an adhesive composition and an organic electronic device including the same, which can be easily applied in a process of forming an encapsulation structure of an organic electronic device, thereby improving processability by preventing bubbles from flowing into the encapsulation structure or clogging of the application nozzle. |