| abstract |
The liquid resin composition of this invention is a resin composition which adhere | attaches a semiconductor element to a support body, The adhesive force in 25 degreeC after heat processing of 120 degreeC and 10 minutes is 0.05 N or less, and the liquid resin composition whose adhesive force in 80 degreeC is 1N or more. to be. Moreover, the semiconductor wafer with an adhesive bond layer of this invention is a semiconductor wafer with an adhesive bond layer formed using the said liquid resin composition as an adhesive bond layer. Moreover, the manufacturing method of the semiconductor element of this invention is a coating process which apply | coats the adhesive agent which consists of a liquid resin composition containing a thermosetting resin and a solvent to the one surface side of a wafer, and the molecular weight of the said liquid resin composition was substantially maintained. It has a volatilization process which volatilizes the said solvent, and forms an adhesive bond layer, the sticking process which sticks a dicing sheet to the one surface side of the said wafer, and the individualization process which individualizes the said wafer. |