| abstract |
PROBLEM TO BE SOLVED: To bond a semiconductor circuit forming substrate and a supporting substrate with one kind of adhesive layer, which has excellent heat resistance, and the adhesive force does not change even during a manufacturing process of a semiconductor device or the like, and thereafter at room temperature. Provided are a temporary bonding adhesive that can be peeled off under mild conditions, and a semiconductor device manufacturing method using the same. The present invention provides a polysiloxane having at least an acid dianhydride residue and a diamine residue, wherein the diamine residue is (A1) represented by the general formula (1) and n is a natural number of 1 or more and 15 or less. (B1) A polyimide copolymer comprising both a residue of a diamine and (B1) a residue of a polysiloxane-based diamine represented by the general formula (1), in which n is a natural number of 16 or more and 100 or less, An adhesive for temporary attachment, which is a polyimide copolymer containing 40 to 99.99 mol% of residues and 0.01 to 60 mol% of residues (B1). [Selection diagram] None |