| abstract |
PROBLEM TO BE SOLVED: To facilitate temporary bonding between a wafer and a support, and to form a high step substrate with a uniform film thickness, to be highly compatible with TSV formation and wafer backside wiring processes, and to be easily peeled, Provided are a wafer processed body capable of enhancing the productivity of a thin wafer, a wafer processing member, a temporary adhesive for wafer processing, and a method of manufacturing a thin wafer using the same. A wafer processing body in which a temporary adhesive material layer is formed on a support, a wafer having a circuit surface on the front surface and a back surface to be processed is laminated on the temporary adhesive material layer, A first temporary adhesive layer comprising a non-silicone thermoplastic resin layer (A), wherein the temporary adhesive layer is releasably bonded to the surface of the wafer, and a thermoplastic siloxane resin polymer laminated on the first temporary adhesive layer. A second temporary adhesive layer comprising a layer (B) and a third temporary adhesive layer comprising a thermosetting siloxane-modified polymer layer (C) laminated on the second temporary adhesive layer and releasably adhered to a support; A processed wafer having a composite temporary adhesive layer having a three-layer structure. [Selection] Figure 1 |