| abstract |
A thermosetting adhesive sheet having excellent laser mark visibility and alignment mark recognition, and a method of manufacturing a semiconductor device using the same. (1) A thermosetting resin composition comprising a thermosetting binder, a light-transmitting filler having an average primary particle diameter of 1 nm to 1000 nm, and a colorant, wherein the content of the light-permeable filler is 30 parts by mass or more and 100 parts by mass or less with respect to 80 parts by mass of the thermosetting binder And the content of the colorant is not less than 0.5 parts by mass and not more than 3.0 parts by mass with respect to 80 parts by mass of the thermosetting binder is cured on the polished surface of the semiconductor wafer before dicing. As a result, the laser marked mark becomes clear, excellent laser mark visibility can be obtained, and accurate alignment using infrared rays can be performed. |