| abstract |
In recent years, epoxy resin compositions have been used in electronic parts such as camera modules. These electronic components are frequently used for Ni-plated members from the viewpoint of conductivity, but conventional epoxy resin compositions have a problem that adhesion is difficult. The present invention was made in view of the above-mentioned circumstances, and an object thereof is to provide an epoxy resin composition having high adhesive strength to a Ni member. An epoxy resin composition for bonding electronic parts, comprising the following components (A) to (C), (A) component: a compound having an epoxy group, (B) component: glass transition temperature It is a polystyrene-type filler of 50 degreeC or more, (C)component: the component which hardens (A) component. |