| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2400-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F222-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2433-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31058
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31133
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30625
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-06 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-06 |
| filingDate |
2013-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dc858c749c9ec03da2eaecd53626e43b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41a4c349a9504fc151eb61aea309c99f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a7f343bafb31fb269cc585c1a8032d58 |
| publicationDate |
2014-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2014050538-A1 |
| titleOfInvention |
Temporary adhesive for semiconductor device production, adhesive substrate using same, and semiconductor device production method |
| abstract |
Provided are: a temporary adhesive for semiconductor device production that contains (A) a polymer compound that is substantially insoluble in an alkaline solution, and has a radical polymerizable group in a side chain, (B) a radical polymerizable monomer, and (C) a photo-radical polymerization initiator; an adhesive substrate that uses the temporary adhesive for semiconductor device production; and a semiconductor device production method. The temporary adhesive for semiconductor device production, the adhesive substrate that uses the temporary adhesive for semiconductor device production, and the semiconductor device production method: enable a member being processed (i.e., a semiconductor wafer or the like) to temporarily be supported by a strong adhesive force when the member being processed is subjected to mechanical or chemical processing; and enable the temporary support of the member being processed to easily be terminated without damaging the member being processed. |
| priorityDate |
2012-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |