http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102150240-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3dfd736ad4834462cb46c4de91685c29 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2433-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 |
| filingDate | 2009-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d73beedbe82c4fac069975b281a121e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3d4f94cd226eecd99965d8e01c871de4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1e6d8165908bfbf4e64d70cd6e47720 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_32958abf4e43fa9b672e65a506520810 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a90ac648ed0207d81b38b3519951c9f2 |
| publicationDate | 2013-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-102150240-B |
| titleOfInvention | Adhesive film for wafer support for processing wafer of semiconductor thin film |
| abstract | The present invention relates to an adhesive film for a wafer support for processing a wafer of a semiconductor thin film. More particularly, the present invention relates to an adhesive film for a wafer support for processing a wafer of a semiconductor thin film which eliminates the necessity of an attachment apparatus in a film-thinning process for a semiconductor wafer, can be used regardless of the semiconductor wafer size, prevents the ingress of grinding water by coating an acrylic adhesive layer onto a heat resistant base, and leaves no adhesive layer on a circuit surface during a delamination process and thus eliminates the necessity of an additional cleaning process, thereby preventing damage to the semiconductor wafer and the contamination of the circuit surface which might occur during a complicated process. To this end, the adhesive film for a wafer support for processing a wafer of a semiconductor thin film according to the present invention comprises a heat-resistant base and a heat-resistant adhesive layer coated on the heat-resistant base, wherein said heat-resistant adhesive layer comprises an acrylic copolymer having a molecular weight of 500,000 to 3,000,000, an energy ray-curable acrylic oligomer, and a photoinitiator. |
| priorityDate | 2009-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 52.