| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_962adbf7d50e742218f3d536a63df612 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate |
2019-03-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_970d1dbe629e0e183e4a9fb6090aeb32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc00c507b39948b998443bb8d676e700
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b90a21f475650c8e591910a273c41814 |
| publicationDate |
2019-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2019181731-A1 |
| titleOfInvention |
Adhesive tape, and method for producing semiconductor device |
| abstract |
[Problem] The purpose of the present invention is to reduce transfer failures when transferring chips 21 from backgrinding tape 10 to pickup tape 30 or to adhesive tape, specifically when producing micro-semiconductor chips using the dice-before-grind method. In addition, another purpose thereof is to improve transfer efficiency when transferring chips from the backgrinding tape 10 to the pickup tape 30 or to the adhesive tape. [Solution] This adhesive tape 10 is favorable for use as a backgrinding tape, includes a substrate 11 and an adhesive layer 12 provided on one surface thereof, and is characterized in that the adhesive layer 12 comprises an energy ray-curable adhesive, and the storage modulus E'200 at 200°C of the adhesive after being cured by irradiation with an energy ray is at least 1.5MPa. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113410164-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021251420-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2021251422-A1 |
| priorityDate |
2018-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |