| abstract |
A thermosetting die-bonding film having both a storage elastic modulus necessary for manufacturing a semiconductor device and a high adhesive force, and a dicing die-bonding film including the thermosetting die-bonding film are provided. A thermosetting die-bonding film 3 is a thermosetting die-bonding film 3 used in manufacturing a semiconductor device, and includes at least an epoxy resin, a phenol resin, an acrylic copolymer, and a filler, and has a temperature of 80 ° C. to 140 ° C. The storage elastic modulus before thermosetting at 10 ° C. is in the range of 10 kPa to 10 MPa, and the storage elastic modulus before thermosetting at 175 ° C. is in the range of 0.1 MPa to 3 MPa. [Selection] Figure 1 |