| abstract |
An object of this invention is to provide the laminated body used suitably as an insulating film in electronic mounting uses, and the adhesive film for semiconductor wafer fixing in semiconductor device uses, the various laminated bodies using the same, and the manufacturing method of a laminated body. It is done.n n n The present invention is a laminate (I) consisting of a base layer (A) and an adhesive layer (B), wherein a B layer is formed on one or both surfaces of the A layer, wherein the A layer is (A-1) a specific wholly aromatic poly. Mid (PI A-1 ) or (A-2) is a film composed of specific wholly aromatic polyamide (PA A- 2 ), and the B layer is (B-1) specific wholly aromatic polyimide (PI B- 1 ), (B-2) Resin composition which consists of specific wholly aromatic polyamide (PA B- 2 ), or (B-3) wholly aromatic polyimide (PI B- 3 ) and specific wholly aromatic polyamide (PA B- 3 ) ( RC B- 3 ) phosphorus laminate, laminates using the same, and a method for producing the laminate.n n n Adhesive film, laminate |