abstract |
The present invention relates to an adhesive composition for infrared peeling capable of being peeled by infrared irradiation, comprising a component (A) cured by hydrosilylation reaction, a component containing an epoxy-modified polyorganosiloxane, and a methyl group-containing polyorganosiloxane It contains at least 1 sort(s) of component (B) selected from the group which consists of a component and the component containing a phenyl group containing polyorganosiloxane. |