| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1467
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54433
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-24 |
| filingDate |
2013-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2015-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-101563784-B1 |
| titleOfInvention |
Method of manufacturing semiconductor device |
| abstract |
A dicing tape comprising a substrate and a pressure-sensitive adhesive layer formed on the substrate; And a wafer backside protective film formed on the pressure sensitive adhesive layer of the dicing tape, wherein the wafer backside protective film is colored by containing a dye. The colored wafer backside protective film preferably has laser markability. The dicing tape-integrated wafer backside protection film is suitably used for a flip chip mounted semiconductor device. |
| priorityDate |
2009-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |