abstract |
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressure-sensitive adhesive composition, a sealing film containing the same, an organic electronic device including the sealing film, and a method of manufacturing the organic electronic device, wherein formation of a structure capable of effectively blocking water or oxygen, Provided is a pressure-sensitive adhesive composition which is excellent in processability during a panel manufacturing process, and is excellent in heat-resistant holding power under high-temperature and high-humidity conditions. |