| abstract |
An adhesion layer-forming composition to allow a substrate to adhere to a photocurable composition at least contains a curable base material (A) containing at least one functional group that binds to a base and at least one radically polymerizable functional group, a polymerization inhibitor (B), and an organic solvent (C), the adhesion layer-forming composition having a polymerization inhibitor (B) content of 0.1 parts by weight or more and 20 parts by weight or less based on 100 parts by weight of the curable base material (A). |