| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J161-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 |
| filingDate |
2020-06-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2022-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2022-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-112424306-B |
| titleOfInvention |
Adhesive composition for semiconductor circuit connection and adhesive film containing the same |
| abstract |
The present disclosure relates to adhesive compositions for semiconductor circuit connections and adhesive films comprising the same. The adhesive composition for semiconductor circuit connection according to the present disclosure may exhibit excellent adhesive strength during thermocompression bonding of semiconductor circuits and minimize wafer warpage caused by stacking of semiconductor circuits. |
| priorityDate |
2019-06-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |