| abstract |
A resin composition suitable as a one-component adhesive used in the manufacture of image sensor modules and electronic components is provided from the viewpoint of thermal curing at a temperature of about 80°C and excellent PCT resistance. The resin composition of the present invention contains (A) an epoxy resin, (B) a compound represented by the following formula (1), (C) a curing accelerator, and (D) a silane coupling agent, and the content of the compound of the component (B) is The equivalent ratio of the epoxy group of the epoxy resin of the component (A) and the thiol group of the compound of the component (B) is 1:0.5 to 1:2.5, and the content of the silane coupling agent of the component (D) is the component (A) , 0.2 to 50 parts by mass with respect to 100 parts by mass of the total amount of the component (B), the component (C) and the component (D), and the thiol group and the (D) silane couple of the compound of the component (B) The resin composition, characterized in that the equivalent ratio of Si of the ring agent is 1:0.002 to 1:1. [Equation 1] |