| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-208
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K101-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-00 |
| filingDate |
2018-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4190d971206252c7bf5a204ae1af3de3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11466234c318f88eb44d2052fde06bd4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddfa387213da42c29b49c95f8ea9bd9c |
| publicationDate |
2020-02-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I685028-B |
| titleOfInvention |
Adhesive tape for semiconductor processing |
| abstract |
The present invention provides a tape for semiconductor processing that can be sufficiently heated and contracted in a short time and can maintain a kerf width. The adhesive tape (10) for semiconductor processing of the present invention is characterized by having an adhesive tape (15) having a base film (11) and an adhesive formed on at least one side of the base film (11) The layer (12) and the aforementioned adhesive tape (15) are calculated as the sum of the thermal deformation rate per 1°C between 40°C and 80°C measured by a thermomechanical characteristic tester at elevated temperature in any first direction Calculated by the sum of the integral value and the thermal deformation rate per 1°C between 40°C and 80°C measured by the thermomechanical characteristic testing machine at a temperature increase in the second direction at right angles to the aforementioned first direction The sum of integral values is negative. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I755743-B |
| priorityDate |
2018-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |