| abstract |
It has excellent heat resistance but also excellent stress relaxation properties, and it can obtain high conductivity that can be applied to power semiconductor backside electrodes without using expensive noble metals such as silver, without protruding from the element. An adhesive film capable of obtaining sufficient adhesive strength and a semiconductor processing method using the same are provided. Specifically, a conductive adhesive film comprising at least two kinds of metal particles containing Cu and a polymer having a polydimethylsiloxane skeleton. Also, a dicing die bonding film obtained by laminating a dicing tape on the conductive adhesive film, and a semiconductor wafer processing method using the adhesive film and the dicing die bonding film. |