http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110358465-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2467-006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-122 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-408 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-255 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-036 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-25 |
| filingDate | 2019-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-11-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-110358465-B |
| titleOfInvention | High-temperature bearing film for circuit board and manufacturing method thereof |
| abstract | The invention relates to a high-temperature bearing film for a circuit board and a manufacturing method thereof, wherein the manufacturing method comprises the following steps: selecting a high-temperature-resistant PET substrate as a PET substrate layer; selecting the acrylate adhesive solution as a material of the acrylate adhesive layer, and coating the acrylate adhesive solution on the PET substrate layer to form the acrylate adhesive layer, wherein the acrylate adhesive solution comprises: 90-110 parts of acrylate glue, 10-30 parts of a diluent solvent capable of dissolving the acrylate glue, 1.0-4.0 parts of a curing agent, 10-40 parts of a diluent solvent capable of dissolving the curing agent and 3.0-13.0 parts of a plasticizer; compounding the acrylate adhesive layer and the release surface of the single-sided release film together to form the high-temperature carrier film; and placing the high-temperature bearing film into a curing room at a certain temperature for a certain time to obtain the completely cured high-temperature bearing film. The high-temperature bearing film for the circuit board has the advantages of high temperature resistance, no adhesive residue, moderate viscosity, no acid-base solution permeation and the like. |
| priorityDate | 2019-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 54.