| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2467-006 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-255 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2020-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd9e015e81f12f1118a264c67cbf3776
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a67c00f01596b40d5642f2e09bcf6a8a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_770c7623008749902a8f82a5532ac002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a9135a797bb251a4f705ef882c24f7f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07ce27a3d523659d5d98bcead6cb3979 |
| publicationDate |
2021-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-202133247-A |
| titleOfInvention |
Adhesive sheet for semiconductor processing and its utilization |
| abstract |
The subject of the present invention is to provide an adhesive sheet for semiconductor processing that can reduce the load during peeling.nAccording to the present application, an adhesive sheet for semiconductor processing including an adhesive layer constituting an adhesive surface is provided. The adhesive layer contains at least one nonionic compound A selected from the group consisting of a surfactant and a compound having a polyoxyalkylene skeleton as a water stripping additive. |
| priorityDate |
2019-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |