| abstract |
The purpose of the present invention is to provide a bonding sheet which is capable of preventing a protruding electrode from being damaged and deformed and preferably used for production of a semiconductor chip mounting body excellent in reliability, and a method for mounting a semiconductor chip using said bonding sheet. The present invention relates to a bonding sheet used for mounting a semiconductor chip having a protruding electrode on the surface thereof on a substrate or another semiconductor chip. The bonding sheet includes: a resin base material composed of a hard layer which has a tensile storage modulus of not less than 0.5 GPa at 40 to 80 DEG C, and a soft layer which is layered on at least one surface of the hard layer, has a tensile storage modulus of from 10 kPa to 9 MPa at 40 to 80 DEG C, and is made of a cross-linking acrylic polymer; and a heat curable adhesive layer which is formed on the soft layer, and has a minimum melt viscosity greater than 3000 Pa.s and less than or equal to 100000 Pa.s when measuring melt viscosity at 40 to 80 DEG C with a rotational rheometer at a temperature increase rate of 5 DEG C/minute and a frequency of 1Hz. |