| abstract |
Provided is a curable silicone composition and applications thereof. The composition has hot-melt properties as a whole, superior workability and curing characteristics such as overmolding, as well as superior flexibility and stress relief properties of a cured product thereof, even when a relatively large amount of filler is blended. Also provided is a cured product with a relatively small coefficient of thermal expansion. A curable silicone composition, comprising: an organopolysiloxane resin where 20 mol % or more of the total siloxane units of the organopolysiloxane resin is siloxane units represented by SiO4/2; and one or more functional fillers. A vinyl (CH2—CH—) group content of curing reactive functional groups containing carbon-carbon double bonds is 0.05 to 1.50 mol % per 100 g of silicone component(s) in the composition. |