| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-416
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2433-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2467-006 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-064
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-255 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate |
2020-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_770c7623008749902a8f82a5532ac002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6a9135a797bb251a4f705ef882c24f7f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_07ce27a3d523659d5d98bcead6cb3979 |
| publicationDate |
2021-06-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20210075873-A |
| titleOfInvention |
Pressure-sensitive adhesive sheet for processing semiconductor |
| abstract |
(Project) The adhesive sheet for semiconductor processing suitable also for the use aspect including a high temperature process is provided. (Solution) The adhesive sheet for semiconductor processing containing the adhesive layer which comprises an adhesive surface is provided. The semiconductor processing pressure sensitive adhesive sheet, in an aspect, the initial normal peel force Fd 0 is more than 0.10 N / 20 ㎜, and usually peel strength after subjected to heat treatment at 150 ℃ 15 bungan Fd a is 1.00 N / 20 ㎜ is below. |
| priorityDate |
2019-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |