| abstract |
An object of the present invention is to provide a novel polymer which can be preferably used as a resin material for semiconductor devices and electronic components. The present invention is a polymer containing a repeating unit represented by Formula 1-1, Formula 1-2, or Formula 1-3, and having a weight average molecular weight of 3,000 to 500,000 in terms of polystyrene measured by GPC using tetrahydrofuran as an elution solvent. And methods for producing the same. In addition, the present invention contains a repeating unit represented by the formula 1-1, formula 1-2 and formula 1-3, the weight average molecular weight of the polystyrene conversion measured by GPC using tetrahydrofuran as the elution solvent is 3,000 to 500,000 An adhesive composition containing a polymer, (B) a thermosetting resin, and (C) a compound having flux activity, an adhesive sheet having an adhesive layer formed using the adhesive composition, and a semiconductor device protective material having the adhesive layer, and The semiconductor device provided with the hardened | cured material of the said adhesive composition is provided. |