| abstract |
One aspect of the present invention provides a polymer having repeating units represented by the formulas (1-1), (1-2) and (1-3) and weight-average molecular weight of from 3,000 to 500,000, as determined by GPC using tetrahydrofuran as a solvent, reduced to polystyrene. Another aspect of the present invention provides an adhesive composition comprising (A) the polymer, (B) a thermosetting resin, and (C) a compound having flux activity. Further, the present invention provides an adhesive sheet having an adhesive layer made of the adhesive composition, a protective material for a semiconductor device, which has the adhesive layer, and a semiconductor device having a cured product obtained from the adhesive composition. |