| abstract |
The present application relates to an adhesive for temporary bonding, an adhesive layer, a wafer processing body, and a method for producing a semiconductor device using the same. The present invention provides an adhesive for temporary bonding, which is excellent in heat resistance and capable of bonding a semiconductor circuit-forming substrate to a semiconductor circuit-forming substrate using one type of adhesive layer, and a method for producing a semiconductor device using the same. The support substrate is adhered, and the adhesive force does not change even after passing through the manufacturing process of a semiconductor device or the like, and it can be peeled off under mild conditions at room temperature after that. The present invention is an adhesive for temporary bonding, characterized in that it is a polyimide copolymer having at least an acid dianhydride residue and a diamine residue, and in the diamine Residues including (A1) a residue of a polysiloxane-based diamine represented by the general formula (1) and n is a natural number of 1 or more and 15 or less, and (B1) represented by the general formula (1) and n is 16. Both of the residues of the polysiloxane-based diamine having a natural number of 100 or more. |