| abstract |
The present invention provides a polyimide resin, a resinncomposition, an adhesive solution, a film-state joiningncomponent, and an adhesive laminate film soluble in a solventnhaving excellent heat resistance and adhesion, capable ofnbonding and curing at relatively low temperatures. Specifically,nthe present invention provides a novel polyimide resin havingnlow water absorption obtained by a reaction betweenntetracarboxylic acid dianhydride containing ester-acidndianhydride represented by the general formula (1):n nwherein X represents -(CH 2 ) k -, or is a divalent group whichncomprises an aromatic ring, and k is an integer from 1 to 10;nand aromatic diamine, where the resin composition and the film-statenjoining component which comprise a thermosetting resinnwith excellent adhesion using this resin are preferably used fornflexible printed circuit boards, tapes for TAB (Tape AutomatednBonding), composite lead frames, and lamination materials, ornthe like, and an adhesive laminate film suitable for coating ofna superconductive wire rod. |