| abstract |
An electroconductive bonding sheet excellent in connection stability is provided even when the compounding amount of electroconductive particles is small. The electroconductive bonding sheet of this invention contains a binder component and electroconductive particle. The conductive particles are dispersed in a state where all the conductive particles are regularly arranged, and when the number Np of dispersed conductive particles is 9 to 25 in a plan view of an arbitrary region of the conductive bonding sheet, the conductive particles in the dispersed The average value of the conductive particles is X, and the distance between the centers of the adjacent dispersed conductive particles arranged regularly in plan view is Y, then 1.5X≦Y≦100X is satisfied, and the primary particle in the arbitrary region is assumed to be When the number of objects is N, N/Np is 1.0 to 100.0, and when a plan view of any three non-overlapping regions including the arbitrary region and the Np of each region is 9 to 25, the The number of dispersed arrangement of conductive particles in two or more regions is Ng, and Ng/Np is 0.8 to 1.0. |