http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-102167491-B1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J125-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-185 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J125-00 |
| filingDate | 2017-03-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | KR-102167491-B1 |
| titleOfInvention | Adhesive film for semiconductor device manufacturing and method for manufacturing semiconductor device |
| abstract | The adhesive film 50 for manufacturing a semiconductor device of the present invention is an adhesive film in a method for manufacturing a semiconductor device including at least the following steps (A) to (C), and the solvent-resistant resin layer 10 and the uneven absorbent water It has the formation layer 20 and the adhesive resin layer 30 in this order, and is used so that the adhesive resin layer 30 may become the 2nd circuit surface 65B side of the semiconductor wafer 60. (A) Having a first circuit surface 65A including a first circuit pattern 63A and a second circuit surface 65B including a second circuit pattern 63B on the opposite side of the first circuit surface 65A The semiconductor wafer 60, the support member 80 provided through the adhesive layer 70 on the first circuit surface 65A side of the semiconductor wafer 60, and the second circuit surface 65B of the semiconductor wafer 60 Process of preparing a structure 100 having an adhesive film 50 bonded to the side (B) Step of removing the support member 80 from the structure 100 (C) A step of removing the residue of the adhesive layer 70 on the first circuit surface 65A side of the semiconductor wafer 60 with a solvent. |
| priorityDate | 2016-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 120.