| abstract |
The present invention relates to a method for bonding micro-electronic components. The method according to the invention comprises a bonding material of a curable conductive adhesive or a flux based solder paste and a donor comprising a dynamic release layer adjacent to the bonding material layer. Providing a donor film; Aligning the laser beam of the laser system and guiding a donor film spaced apart from the surface of the substrate by a predetermined distance; Applying a laser beam on the dynamic emission layer such that the dynamic emission layer is activated so that a selected portion of the connection pad or connection pad structure is covered with a bonding material transmitted from the bonding material layer; Introducing a micro-electronic component having the connection pad into the pad structure such that one or both pads and a bonding material on the pad structure form an electrical connection between the pad structure and each pad; And bonding the micro-electronic component by curing the conductive adhesive of the bonding material or reflowing the solder paste. Thus, the adhesive material can be transferred while preventing the effect of the adhesive from falling due to thermal overexposure in the transfer process. |