| abstract |
The present invention provides an adhesive sheet and a method for manufacturing a semiconductor device using the same, which can be sufficiently and stably attached without peeling from a lead frame even if it is subjected to a thermal history accompanying QFN assembly before a peeling step. Even when the back surface and the back surface of the sealing resin are peeled off, the sealing resin does not leak, and it can be easily peeled off in the peeling process, and no adhesive residue or breakage occurs. An adhesive sheet for manufacturing a semiconductor device includes a base material and a thermosetting adhesive layer provided on one surface of the base material, and is releasably attached to a lead frame or a wiring board of a semiconductor device. In the splices, the adhesive layer contains a carboxyl-containing acrylonitrile-butadiene copolymer (a), an epoxy resin (b) having the following structural formula (1), and two or more maleimides containing In the compound (c) of the base, the residual amount of unreacted maleimide is 0.02 to 0.13. |