| abstract |
A method of making a pressure-sensitive adhesive curable composition performed at a temperature not exceeding 35°C. The method comprises the following steps: 1) mixing starting materials comprising: A) >0 to 40 parts by weight of polyorganosiloxane resin; B) 60 to <100 parts by weight of silanol terminated polydiorganosiloxane oxane, C) >30% to <100% by weight of organic solvent, based on the combined weight of starting materials A, B and C, to form a mixture; 2) adding starting materials D) amino groups to the mixture functional alkoxysilane; 3) adding starting material E) a silyl phosphate compound after step 2), thereby preparing a pressure-sensitive adhesive composition; and 4) adding the pressure-sensitive adhesive composition to the pressure-sensitive adhesive composition A starting material including F) an organic peroxide compound is added to form the pressure-sensitive adhesive curable composition. |