| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2852
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2891
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-0016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F220-1804 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L67-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J167-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-02 |
| filingDate |
2011-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a49cf7747e15838cec22c383e799e44b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_48a4dcb99baabc746c665fdbef6b5e6f |
| publicationDate |
2012-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201203342-A |
| titleOfInvention |
Adhesive sheet for semiconductor wafer processing |
| abstract |
Provided is an adhesive sheet for semiconductor wafer processing: that has excellent storage stability in various environments; that can prevent an adherend from being contaminated even after use; that has excellent ability to adjust to bumps formed by a circuit pattern, and has excellent stability in the amount by which the adhesive sheet rises over time when attached to a surface on which the circuit pattern of a semiconductor wafer is formed. The adhesive sheet for semiconductor wafer processing is provided with an adhesive layer on at least one side of a base material. The adhesive layer is formed by adding a polyester plasticizer and surfactant to a base polymer. The solubility parameters (SP values) of the plasticizer and the surfactant satisfy the relationship of 0.9 = [the SP value of the plasticizer]/[the SP value of the surfactant] = 1.0. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104756235-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I506118-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-104756235-A |
| priorityDate |
2010-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |