| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_083acc73c083e9bb72f0c84d0061252e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J179-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J177-08 |
| filingDate |
2001-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c891d5cf419a4266fb2d76cdd5773cd4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2a787ad8ed1cfee2dd6ebf1032dc3393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_399af5e42aac2fee55318b4aa447279a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4ed42de9cf39c7e5d5e82d118196747 |
| publicationDate |
2002-08-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20020065723-A |
| titleOfInvention |
Adhesive for electronic parts and adhesive tape using the same |
| abstract |
It is an object of the present invention to provide a polyimide adhesive and an adhesive tape using the same, which exhibit excellent properties of stability and adhesion at high temperatures by improving flowability at high temperatures while maintaining the heat resistance and mechanical properties of the polymer. .n n n The present invention is a liquid adhesive dissolved in an organic solvent, at least one of the structural units represented by the formula (1) in the adhesive resin, at least one of the structural units represented by the formula (2) or the structural unit represented by the formula (3) An adhesive comprising at least one polyimide comprising at least one of the above and an adhesive tape characterized by laminating it after application drying on a heat resistant film or a peelable film, the adhesive and the adhesive thus obtained The tape is very useful when used for electronic parts requiring high reliability such as semiconductor chip production process because of its excellent high temperature stability and adhesion. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20200096319-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7239022-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20170104007-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100568569-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100580567-B1 |
| priorityDate |
2001-02-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |