| abstract |
PROBLEM TO BE SOLVED: To provide a heat-bonding sheet in which protrusion or die-up on a chip surface during die attachment is suppressed and high reliability and thermal characteristics can be obtained even in a high temperature environment. SOLUTION: Tensile elastic modulus is 10 to 3000 MPa, metal fine particles are contained in a range of 60 to 98% by weight, and the temperature is increased from 23 ° C. to 400 ° C. at a temperature rising rate of 10 ° C./min in an air atmosphere. A heat-bonding sheet having a carbon concentration of 15% by weight or less obtained by energy dispersive X-ray analysis after heating. [Selection] Figure 1 |