| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d5d04736b0b882a4f5a1e0e0e4cd8cbb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J4-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J175-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J175-08 |
| filingDate |
2020-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51303c9201fc266502520aedc1693ffc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_10c277abd435cb35823ede8e66226671 |
| publicationDate |
2021-06-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2021125152-A1 |
| titleOfInvention |
Tape for semiconductor processing |
| abstract |
Provided is a tape for semiconductor processing which sufficiently reduces the influence of surface irregularities and has a moderate pressure-sensitive adhesive force and antistatic performance and which is less apt to leave an adhesive residue upon removal and can be produced through a few steps. The tape for semiconductor processing comprises: a sheet-shaped substrate comprising a substrate main body and an antistatic layer disposed on at least one surface thereof; and a pressure-sensitive adhesive layer. The antistatic layer includes a polypyrrole compound. The pressure-sensitive adhesive layer is a cured object obtained from a pressure-sensitive adhesive composition and has a thickness of 50-500 μm. The pressure-sensitive adhesive composition comprises one or more polyurethanes (A), a (meth)acrylate monomer (B) comprising a compound having a (meth)acryloyloxy group, a chain-transfer agent (C), and a photopolymerization initiator (D). The polyurethanes (A) include a polyurethane (a1) having (meth)acryloyl groups at a plurality of ends. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115058218-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-115044340-A |
| priorityDate |
2019-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |