| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2919
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-35
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J161-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00 |
| filingDate |
2015-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0014a1119c9a39af1795c49594cafe4e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1589785b3fb3faac5995e646223c34f0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45f3e75392730f01a4d41db42f018fa2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2b60a7bbd8a53df9b805291155fe4437
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6fd396982571291ceb4307e5518a538 |
| publicationDate |
2016-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2016219619-A |
| titleOfInvention |
Adhesive sheet, dicing tape integrated adhesive sheet, film, method for manufacturing semiconductor device, and semiconductor device |
| abstract |
An adhesive sheet that can prevent peeling from a lead frame in reflow and can effectively release heat generated in a chip to the lead frame, a dicing tape-integrated adhesive sheet including the adhesive sheet, a film, and a semiconductor device A method for manufacturing a semiconductor device is provided. The adhesive sheet is cured by maintaining at 175 ° C. for 5 hours in contact with a copper lead frame, and then the adhesive strength at 260 ° C. after maintaining at 85 ° C. and 85% RH for 24 hours is 1 MPa or more. The storage elastic modulus at 260 ° C. is 10 MPa to 100 MPa after curing by maintaining 120 ° C. for 1 hour and then maintaining 175 ° C. for 1 hour. The glass transition temperature is 100 ° C. or lower. The thermal conductivity is 1 W / m · K or more. The adhesive sheet has an epoxy equivalent of 400 g / eq. The above epoxy resin and filler are included. [Selection figure] None |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020075663-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023286389-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7178529-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020130097-A1 |
| priorityDate |
2015-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |