Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J4-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-10 |
filingDate |
2002-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d79eccfcd34c42cf4247a1314f9be4ae http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d8751050e75c8654a1f4e24c2aef225 |
publicationDate |
2004-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2004043694-A |
titleOfInvention |
Film adhesive, method of manufacturing semiconductor device using the same, and semiconductor device |
abstract |
An object of the present invention is to provide a reflow-resistant and crack-resistant die-attach film capable of attaching a film having both functions of a die-attach film and a dicing film to a wafer at a normal temperature or a mild condition in a semiconductor assembling process. An adhesive comprising a thermoplastic polyimide resin and a thermosetting resin having a storage elastic modulus of 50 MPa or more at 260 ° C. is bonded at a low temperature of 50 ° C. or less to a back surface of a wafer on which a number of semiconductor elements are formed. A die attach film with a dicing sheet function that can obtain a wafer with an agent. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101375276-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016219619-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101414393-B1 |
priorityDate |
2002-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |