Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
filingDate |
2019-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ffccd93dc7f9b7c0fa3f825418a0886c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0c9ad41c4ecf8ff58ab639faaa253db http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5c3d0fe68dc49180859853ca136b8b0e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_76d48bef5bc474d2d6f3257e4b857e19 |
publicationDate |
2020-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2020130097-A1 |
titleOfInvention |
Sealing composition and semiconductor device |
abstract |
This sealing composition contains: a first epoxy resin having an epoxy group equivalent of 300 g/eq or greater and a glass transition temperature of 40°C or lower when cured using a polyfunctional phenol resin curing agent and a phosphorus curing promoter; a curing agent; and an inorganic filler. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11790637-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11282194-B2 |
priorityDate |
2018-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |