| abstract |
Film for semiconductor, method for manufacturing semiconductor device, and semiconductor device capable of improving adhesion strength to substrate while improving embeddability to unevenness of substrate surface even when heat history to adhesive layer becomes long To provide. A semiconductor film 10 is formed by laminating an adhesive layer 3 and a support film 4, and the adhesive layer 3 includes a repeating unit including a first monomer unit having a hydroxyl group and a second monomer unit having a carboxyl group. The acrylic resin has a content of the first monomer unit and the second monomer unit contained in the repeating unit of 0.1 to 3 mol%, respectively. [Selection] Figure 2 |