abstract |
The die attach paste according to the present invention comprises: a (meth)acrylic copolymer (A) having a reactive group; a (meth)acrylic monomer (B); and a filler (C), the reactive group of the (meth)acrylic copolymer (A) being at least one group selected from an epoxy group, an amino group, a vinyl group, a carboxyl group, and a hydroxyl group, the weight average molecular weight of the (meth)acrylic copolymer (A) being 2000-14000, and the particle size D 50 of the filler (C) upon 50% accumulation in a volume-basis particle size distribution being 0.3-4.0 μm. |