Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32245 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00 |
filingDate |
2011-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d94182537e15891cba5f82bc2862e8c7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e1da1904bf9ab95c45728cd004b906a1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a2c240c627796a21e546d8b32d38f9dc |
publicationDate |
2012-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2012253088-A |
titleOfInvention |
Semiconductor device |
abstract |
A semiconductor device having excellent thermal conductivity and adhesiveness is provided. A semiconductor device includes a base material, a semiconductor element, and an adhesive layer that is interposed between the base material and the semiconductor element and bonds them together. In the semiconductor device 10, hollow particles made of metal are dispersed in the adhesive layer 1. The adhesive layer 1 is formed by pressure-bonding a paste-like resin composition containing hollow particles made of metal between the semiconductor element 3 and the substrate 2. [Selection] Figure 1 |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114269849-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-6319530-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-7320068-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2018034234-A1 |
priorityDate |
2011-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |