| abstract |
The present invention relates to an anisotropic conductive adhesive comprising a polyurethane resin, which is a thermoplastic resin, and solder particles positioned in a dispersed state in the polyurethane resin, wherein the anisotropic conductive adhesive includes a polyurethane resin as a thermoplastic resin, solder There is no network formation of resin by reaction with reducing agents and additives used to remove metal oxides from the surface of particles, so it is advantageous for self-organization on electrode patterns when forming solder bumps and manufacturing bonding structures, processing in the air is possible, and the self-organization After performing the process, it is easy to remove the remaining residue. |