| abstract |
The present invention relates to a pressure-sensitive adhesive tape that can be removed without residue and non-destructively by ductile stretching substantially in the plane of the bond, the pressure-sensitive adhesive tape comprising an adhesive layer, wherein the adhesive layer consists of a pressure-sensitive adhesive, The pressure sensitive adhesive is based on a vinyl aromatic block copolymer and a tackifying resin, wherein at least 75% by weight (based on the total amount of resin) of the resin is selected to have a DACP (diacetone) greater than -20°C, preferably greater than 0°C alcohol cloud point) and a softening temperature (ring & ball method) greater than or equal to 70°C, preferably greater than or equal to 100°C, and wherein the pressure-sensitive adhesive is foamed. |