Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_424db9d56b06a23aed410fcf5df652f3 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0758 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-80 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0751 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0757 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-70 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 |
filingDate |
2015-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bc60f3c385be89406bc493a08a2907f3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a3af280f816f19d47c9a20fcf7ca04a |
publicationDate |
2015-09-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2015261088-A1 |
titleOfInvention |
Uv-curable adhesive silicone composition, uv-curable adhesive silicone composition sheet, optical semiconductor apparatus and method for manufacturing the same |
abstract |
A method of manufacturing an optical semiconductor apparatus includes: cutting a UV-curable adhesive silicone composition sheet into small chips; disposing the resulted chip on a surface of an optical semiconductor device; irradiating UV-rays to the chip via a photomask according to lithography; developing an uncured portion of the chip with a solvent; and heat-curing after that. The UV-curable adhesive silicone composition sheet is obtained by forming a UV-curable adhesive silicone composition into sheet-form, the UV-curable adhesive silicone composition including: (A) an organopolysiloxane having a resin structure of R 1 SiO 3/2 , R 2 2 SiO 2/2 , and R 3 a R 4 b SiO (4-a-b)/2 units, (B) an organohydrogenpolysiloxane having a resin structure of R 1 SiO 3/2 , R 2 2 SiO 2/2 , and R 3 c H d SiO (4-c-d)/2 units, and (C) a photoactive catalyst. The UV-curable adhesive silicone composition is in a plastic solid state or a semi-solid state in an uncured state at room temperature. |
priorityDate |
2012-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |