| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b0120933550ea729b9f3186c3772531b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67248
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301 |
| filingDate |
2018-09-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ddfa387213da42c29b49c95f8ea9bd9c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4190d971206252c7bf5a204ae1af3de3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11466234c318f88eb44d2052fde06bd4 |
| publicationDate |
2020-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I694508-B |
| titleOfInvention |
Adhesive tape for semiconductor processing |
| abstract |
The present invention provides a tape for semiconductor processing that can be sufficiently heated and contracted in a short time and can maintain a kerf width. The adhesive tape (10) for semiconductor processing of the present invention is characterized by having an adhesive tape (15) having a base film (11) and an adhesive formed on at least one side of the base film (11) Layer (12), the average value of the differential value of the thermal deformation rate per 1°C between 40°C and 80°C in the MD direction of the aforementioned adhesive tape (15) measured by a thermomechanical characteristic testing machine at elevated temperature and In the TD direction, the sum of the average values of the differential values of the thermal deformation rate per 1°C between 40°C and 80°C measured by the thermomechanical characteristic tester at the time of temperature rise is a negative value. |
| priorityDate |
2018-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |