| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2301-312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68336
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2203-326 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J7-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-02 |
| filingDate |
2018-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0014a1119c9a39af1795c49594cafe4e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_837f51ca2d7606e381069127d94ef66d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d9ac9da62dbd89f7f9306efbf84c9a94
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45f3e75392730f01a4d41db42f018fa2 |
| publicationDate |
2020-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2020061422-A |
| titleOfInvention |
Dicing die bond film |
| abstract |
PROBLEM TO BE SOLVED: To provide a dicing die bond film capable of realizing a good pickup for a semiconductor chip with an adhesive layer after cleaving even after a long time has passed since the production. A dicing tape having a laminated structure including a substrate and a pressure-sensitive adhesive layer, and an adhesive layer releasably adhered to the pressure-sensitive adhesive layer in the dicing tape, the pressure-sensitive adhesive layer comprising: A polymer having a radical polymerizable functional group and a structural part derived from a crosslinking agent having a first functional group other than the radical polymerizable functional group while maintaining the radical polymerizable property of the radical polymerizable functional group, and the first functional group. A radical polymerization initiator having a second functional group capable of reacting with a group, and a dicing die bond film. [Selection diagram] Figure 1 |
| priorityDate |
2018-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |