| abstract |
The adhesive film (50) of the present invention is an adhesive film used to temporarily fix the electronic component when the electronic component is sealed with a sealing material in a manufacturing process of an electronic device, and includes a base material layer (10), a setting The adhesive resin layer (A) for temporarily fixing the electronic component on the first surface (10A) side of the base material layer (10), and the second surface (10B) side of the base material layer (10) In addition, the adhesive resin layer (B) whose adhesive force is lowered due to external stimuli, the adhesive resin layer (A) contains a polycarboxylate-based plasticizer (X) and an adhesive resin (Y), and the adhesive resin layer (A) The content of the polycarboxylic acid ester-based plasticizer (X) in ) is not less than 0.7 parts by mass and not more than 50 parts by mass relative to 100 parts by mass of the adhesive resin (Y) contained in the adhesive resin layer (A). |